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    Effect of patterned surfaces on thermal impedance reduction

    Author
    Raeisi Fard, Hafez
    View/Open
    174857_RaeisiFard_rpi_0185E_10471.pdf (3.503Mb)
    Other Contributors
    Borca-Tasçiuc, Theodorian; Koratkar, Nikhil A. A.; Borca-Tasçiuc, Diana-Andra; Plawsky, Joel L., 1957-; Karlicek, Robert F.;
    Date Issued
    2014-12
    Subject
    Mechanical engineering
    Degree
    PhD;
    Terms of Use
    This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.;
    Metadata
    Show full item record
    URI
    https://hdl.handle.net/20.500.13015/1326
    Abstract
    COMSOL was used to simulate how these structures will enhance the heat transfer from the heat source and predict heat transfer enhancement. Proof of concept experiment was performed using patterned surfaces and Polydimethylsiloxane (PDMS). It was shown that effective thermal conductivity of PDMS can be enhanced by at least 6-fold and ITR can be reduced by 10 times using surface patterning.; This work develops a new scheme to increase heat transfer from the light emitting diodes (LED) to heat sink and reduce thermal interface impedances. LEDs packaging has three different main streams: lighting, electrical driver and thermal management. While other streams are growing really fast, thermal management is in its early stages. Like any other packages, LEDs thermal management is a combination of external cooling systems, heat spreaders, and thermal interfaces and among them the latter one has received less attention due to its complexity and difficulties. It has been estimated that up to 30% of input power will dissipate to heat at the interfaces and increase LED junction temperature. Higher junction temperature consequently will decrease both luminous efficiency and life time of the LED. This work introduces a new method to decrease interface thermal resistance using engineered surfaces. These surfaces will be patterned with micron size copper pillars and the effect of diameter (D), height (h) and pitch (P) of these pillars as well as their shape will be addressed.;
    Description
    December 2014; School of Engineering
    Department
    Dept. of Mechanical, Aerospace, and Nuclear Engineering;
    Publisher
    Rensselaer Polytechnic Institute, Troy, NY
    Relationships
    Rensselaer Theses and Dissertations Online Collection;
    Access
    Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Libraries.;
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    • RPI Theses Online (Complete)

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