Directed self-assembly of mesoscopic components for LED applications

Abstract

Through this thesis work, it was demonstrated that assembly in liquid using ferromagnetic dies can be done either with high speed or with high yield, but not with both at the same time. DSA using diamagnetic levitation offers a way to achieve both through a careful design of magnetic field, thickness and quality of diamagnetic material (graphite) as well as proper selection of vibration pattern. This DSA process can enable large-area parallel assembly of millimeter and sub-millimeter components for manufacturing of LED panels, displays and microcell photovoltaics.

Light-emitting diodes (LEDs) constitute a rapidly evolving and fast growing technology that promises to replace incandescent bulbs and compact fluorescent lights in many illumination applications. Large-area LED luminaires have a capability to transform lighting by providing a venue for development of smart lighting systems with additional benefits, such as visible light communications, sensing, health and productivity improvement through color temperature control, capability of creating "virtual sky" ceiling, and many others. The objective of this work is to explore directed self-assembly (DSA) approaches suitable for cost-effective assembly of large amount of LEDs and other mesoscopic (i.e. millimeter and sub-millimeter) electronic components and thus to enable manufacturing of smart lighting luminaires.

Existing alternative approaches for assembly of semiconductor dies are examined including transfer printing, laser-assisted die transfer, and various directed self-assembly approaches using shape-recognition, magnetic and capillary forces, etc. After comparing their advantages and limitations, we developed two approaches to magnetic force-assisted DSA of LEDs on a large-area substrate in liquid and air medium.

The first approach involves pick-up of buoyant and magnetic dies from the liquid surface onto the flexible substrate in a roll-to-roll process. The possibility of high-speed assembly of LED dies is demonstrated, but with a low yield due to the influence of the capillary force of the carrier liquid and the difficulty in ensuring reliable supply of dies to the assembly interface. To overcome the aforementioned challenges this process was modified to assemble the dies by sinking them onto the receiving substrate with a stencil mask on top, demonstrating LED assembly with a very low error rate but at a lower speed. A solder-assisted self-alignment is used to further improve placement precision and to ensure the proper orientation of the dies.

The second approach involves self-assembly of dies in an air medium by levitating them in a periodic magnetic field. Using only vibration in z-direction with properly selected waveforms, both high-yield and high-speed DSA was demonstrated. Magnetostatic simulations were used to demonstrate scaling of DSA process with the die size while a model based on a 2D random walk was used to show how the assembly time scales with the number of dies and how this scaling law can be improved. These results indicate that this process can scale well both with the die size and with the number of assembled dies.