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    A fundamental study of transient processes in microscale flow boiling heat transfer

    Author
    Rao, Sameer Raghavendra
    View/Open
    176715_Rao_rpi_0185E_10743.pdf (6.513Mb)
    Other Contributors
    Peles, Yoav; Borca-Tasçiuc, Theodorian; Chung, Aram; Plawsky, Joel L., 1957-;
    Date Issued
    2015-08
    Subject
    Mechanical engineering
    Degree
    PhD;
    Terms of Use
    This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.;
    Metadata
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    URI
    https://hdl.handle.net/20.500.13015/1526
    Abstract
    In this work, experimental methods, data processing technique, and results along this vein are presented. With a new microdevice architecture, synchronized temperature and high-speed camera footage several interactions encountered in flow boiling are examined.; Using a computational workflow to decouple the conjugated conduction-convection effects and account for the transient heat loss (or gain), the local and transient heat transfer coefficient was measured for different flow regimes. Using a non-dimensional number to describe the extent of damping exerted by the substrate, detailed considerations of sensor design for transient studies are presented. Based on these fundamental heat transfer considerations spatiotemporal bounds are identified that allow for a continuous estimate of the transient heat transfer coefficient. These estimates of the spatiotemporally resolved heat transfer coefficient are compared to the time averaged considerations for the thin-film evaporation process accompanying slug flow.; Electronics cooling is at the forefront of the design of the next generation of commercial and military electronics. Several developments in the design of electronics have created the need for an unprecedented level of integration between the electronic and thermal components. Flow boiling in microchannels offers significant advantages over other competing technologies to address the grand scale of challenges involved with the advent of 3-D chip stacks. Practical implementations are limited by the lack of fundamental knowledge controlling the heat transfer processes at confined length scales. Transient local wall temperature and heat transfer coefficient measurements can be used to address several of these gaps in contemporary literature.;
    Description
    August 2015; School of Engineering
    Department
    Dept. of Mechanical, Aerospace, and Nuclear Engineering;
    Publisher
    Rensselaer Polytechnic Institute, Troy, NY
    Relationships
    Rensselaer Theses and Dissertations Online Collection;
    Access
    Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Libraries.;
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    • RPI Theses Online (Complete)

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