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dc.rights.licenseRestricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Libraries.
dc.contributorLewis, Daniel J.
dc.contributorUllal, Chaitanya
dc.contributorHuang, Liping
dc.contributor.authorPeters, Scott
dc.date.accessioned2021-11-03T08:55:48Z
dc.date.available2021-11-03T08:55:48Z
dc.date.created2018-02-21T13:08:11Z
dc.date.issued2017-12
dc.identifier.urihttps://hdl.handle.net/20.500.13015/2114
dc.descriptionDecember 2017
dc.descriptionSchool of Engineering
dc.description.abstractIn this thesis, we discuss how structure prediction for DNA-NP solutions have been done previously, and expand upon the work done by using a model that includes three different energies present within bonds between DNA-NPs: duplex energy, elastic bending energy, and electrostatic potential energy. We first explain the various facets of the structure of these DNA-NPs, and how they play a role in determining the exact values for each of the three energies present in our model. In doing so, we develop quantitative expressions for the value of each of these energies, and determine the total bonding energy between DNA-NPs as a function of separation distance. We then use these plots to predict the lattice energies of various crystal structures the DNA-NPs may adopt, and predict which one(s) should be observed for different experimental parameters important to the model. Our results show that this model is capable of qualitatively explaining thermal expansion of DNA-NP lattices, a maximum separation distance less than twice the hydrodynamic radius of the DNA-NPs, a CsCl to AuCu transition within a DNA-NP solution by blending DNA strand coverages,and why CsCl is typically preferred over AuCu for purely-complementary DNA-NP systems.
dc.language.isoENG
dc.publisherRensselaer Polytechnic Institute, Troy, NY
dc.relation.ispartofRensselaer Theses and Dissertations Online Collection
dc.subjectMaterials engineering
dc.titleThermodynamic modelling of DNA-Nanoparticle bonding and crystallization
dc.typeElectronic thesis
dc.typeThesis
dc.digitool.pid178756
dc.digitool.pid178757
dc.digitool.pid178758
dc.rights.holderThis electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
dc.description.degreeMS
dc.relation.departmentDept. of Materials Science and Engineering


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