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dc.rights.licenseRestricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Libraries.
dc.contributorTomozawa, Minoru
dc.contributorDoremus, R. H.
dc.contributorMurarka, S. P.
dc.contributorWatson, Bruce
dc.contributor.authorOehler, Andrea C.
dc.date.accessioned2021-11-03T08:58:34Z
dc.date.available2021-11-03T08:58:34Z
dc.date.created2018-03-01T12:10:52Z
dc.date.issued1995-05
dc.identifier.urihttps://hdl.handle.net/20.500.13015/2152
dc.descriptionMay 1995
dc.descriptionSchool of Engineering
dc.description.abstractThe chemical durability of silica influences the life span of optical communications fibers. Chemical durability may also influence the mechanical properties of silica. In addition, chemical durability may be important in chemical mechanical polishing, CMP, a planarization technique for multilayer integration of microelectronic devices. The key to understanding the chemical durability of silica glass is the effect water in silica can have on the dissolution rate.
dc.description.abstractThe dissolution rate of silica glass versus water concentration in the glass was measured by mass loss using several types of aqueous solutions; 5% and lO%HF solutions, distilled water and 2N NaOH solution. Increasing the amounts of hydroxyl and molecular water in the glass accelerated the dissolution rate in HF solutions and distilled water. In addition, structural modifications caused by long hydration heat-treatments can also influence the dissolution in HF solutions. For 2N NaOH, it appears that structural changes, caused by hydration heat-treatments prior to etching, increase the dissolution rate of silica glass and the concentration of hydroxyl or molecular water in the glass does not affect the dissolution rate.
dc.description.abstractAfter hydration, hydroxyl and molecular water established equilibrium where K = [SiOH]ⁿ/[H₂0]. According to the studies of the reaction at high temperature, Si-O-Si + H₂0 ↔ 2·SiOH, n should be 2. However, n was 1 for silica treated at low temperatures. This indicates that the two hydroxyls formed in the glass during the reaction are not independent after the reaction. Also, the analysis indicates the presence of molecular water and hydroxyl may cause very small structural modifications of silica glass.
dc.description.abstractWhen water (H₂O) enters silica glass (Si0₂) it will either react to form a strongly bound hydroxyl (SiOH) or bond more loosely as molecular water. The amount and type of water species in the glass were varied by hydration treatments at 250°C in an acid digestion bomb and dehydration treatments in an annealing furnace. The concentration of each type of water was measured using Fourier Transform Infrared Spectroscopy.
dc.language.isoENG
dc.publisherRensselaer Polytechnic Institute, Troy, NY
dc.relation.ispartofRensselaer Theses and Dissertations Online Collection
dc.subjectMaterials engineering
dc.titleWater diffusion into silica glass at low temperatures and high pressures and its effect on the chemical durability of glass
dc.typeElectronic thesis
dc.typeThesis
dc.digitool.pid178868
dc.digitool.pid178869
dc.digitool.pid178870
dc.rights.holderThis electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
dc.description.degreePhD
dc.relation.departmentDept. of Materials Engineering


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