| dc.rights.license | Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries. | |
| dc.contributor | Lu, James | |
| dc.contributor.author | Xu, Zheng | |
| dc.date.accessioned | 2021-11-03T09:37:48Z | |
| dc.date.available | 2021-11-03T09:37:48Z | |
| dc.date.created | 2009-08-31T13:39:30Z | |
| dc.date.issued | 2009-08 | |
| dc.identifier.uri | https://hdl.handle.net/20.500.13015/2807 | |
| dc.description | August 2009 | |
| dc.description | School of Engineering | |
| dc.description | Center for Integrated Electronics | |
| dc.language.iso | ENG | |
| dc.publisher | Rensselaer Polytechnic Institute, Troy, NY | |
| dc.relation.ispartof | Rensselaer Theses and Dissertations Online Collection | |
| dc.subject | Electrical engineering | |
| dc.title | Performance of through strata vias (TSVs) in three-dimensional integration | |
| dc.type | Electronic thesis | |
| dc.type | Thesis | |
| dc.digitool.pid | 19448 | |
| dc.digitool.pid | 19449 | |
| dc.digitool.pid | 19451 | |
| dc.digitool.pid | 19450 | |
| dc.digitool.pid | 19452 | |
| dc.rights.holder | This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author. | |
| dc.description.degree | MS | |
| dc.relation.department | Dept. of Electrical, Computer, and Systems Engineering | |
