High-performance memory systems using 3D IC technology

dc.rights.license	Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries.
dc.contributor	McDonald, John F. (John Francis), 1942-
dc.contributor	Zhang, Tong
dc.contributor	Salama, Khaled N.
dc.contributor	Carothers, Christopher D.
dc.contributor.author	Zia, Aamir
dc.date.accessioned	2021-11-03T09:38:03Z
dc.date.available	2021-11-03T09:38:03Z
dc.date.created	2009-09-08T10:52:20Z
dc.date.issued	2009-12
dc.identifier.uri	https://hdl.handle.net/20.500.13015/2814
dc.description	December 2009
dc.description	School of Engineering
dc.description	Center for Integrated Electronics
dc.language.iso	ENG
dc.publisher	Rensselaer Polytechnic Institute, Troy, NY
dc.relation.ispartof	Rensselaer Theses and Dissertations Online Collection
dc.subject	Electrical engineering
dc.title	High-performance memory systems using 3D IC technology
dc.type	Electronic thesis
dc.type	Thesis
dc.digitool.pid	19483
dc.digitool.pid	19484
dc.digitool.pid	19486
dc.digitool.pid	19485
dc.digitool.pid	19487
dc.rights.holder	This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
dc.description.degree	PhD
dc.relation.department	Dept. of Electrical, Computer, and Systems Engineering

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