Delamination nanomechanics at organosilane-tailored copper-silica interfaces
Authors
Jain, Ashutosh
ORCID
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Other Contributors
Ramanath, G. (Ganpati)
Tomozawa, Minoru
Keblinski, Pawel
Picu, Catalin R.
Lane, Michael W.
Huang, Liping
Tomozawa, Minoru
Keblinski, Pawel
Picu, Catalin R.
Lane, Michael W.
Huang, Liping
Issue Date
2009-12
Keywords
Materials engineering
Degree
PhD
Terms of Use
This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
Full Citation
Abstract
Description
December 2009
School of Engineering
School of Engineering
Department
Dept. of Materials Science and Engineering
Publisher
Rensselaer Polytechnic Institute, Troy, NY
Relationships
Rensselaer Theses and Dissertations Online Collection
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