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dc.rights.licenseRestricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries.
dc.contributorRamanath, G. (Ganpati)
dc.contributorTomozawa, Minoru
dc.contributorKeblinski, Pawel
dc.contributorPicu, Catalin R.
dc.contributorLane, Michael W.
dc.contributorHuang, Liping
dc.contributor.authorJain, Ashutosh
dc.date.accessioned2021-11-03T09:38:46Z
dc.date.available2021-11-03T09:38:46Z
dc.date.created2009-12-09T15:42:14Z
dc.date.issued2009-12
dc.identifier.urihttps://hdl.handle.net/20.500.13015/2829
dc.descriptionDecember 2009
dc.descriptionSchool of Engineering
dc.language.isoENG
dc.publisherRensselaer Polytechnic Institute, Troy, NY
dc.relation.ispartofRensselaer Theses and Dissertations Online Collection
dc.subjectMaterials engineering
dc.titleDelamination nanomechanics at organosilane-tailored copper-silica interfaces
dc.typeElectronic thesis
dc.typeThesis
dc.digitool.pid20170
dc.digitool.pid20171
dc.digitool.pid20173
dc.digitool.pid20172
dc.digitool.pid20174
dc.rights.holderThis electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
dc.description.degreePhD
dc.relation.departmentDept. of Materials Science and Engineering


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