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    Electrical evaluation and modeling of through-strata-vias (TSVs) in three-dimensional (3D) integration

    Author
    Xu, Zheng
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    32507_phd thesis as RPI format.pdf (18.99Mb)
    32508_abstitle-phd.pdf (70.74Kb)
    Other Contributors
    Lu, James; Dutta, Partha S.; Nayak, Saroj K.; Rose, K. (Kenneth); Zhang, Tong;
    Date Issued
    2011-12
    Subject
    Electrical engineering
    Degree
    PhD;
    Terms of Use
    This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.;
    Metadata
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    URI
    https://hdl.handle.net/20.500.13015/3423
    Abstract
    Description
    December 2011; School of Engineering; Center for Integrated Electronics
    Department
    Dept. of Electrical, Computer, and Systems Engineering;
    Publisher
    Rensselaer Polytechnic Institute, Troy, NY
    Relationships
    Rensselaer Theses and Dissertations Online Collection;
    Access
    Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Libraries.;
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    • RPI Theses Online (Complete)

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