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dc.rights.licenseRestricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Libraries.
dc.contributorLu, James
dc.contributorDutta, Partha S.
dc.contributorNayak, Saroj K.
dc.contributorRose, K. (Kenneth)
dc.contributorZhang, Tong
dc.contributor.authorXu, Zheng
dc.date.accessioned2021-11-03T10:17:46Z
dc.date.available2021-11-03T10:17:46Z
dc.date.created2012-01-27T16:08:46Z
dc.date.issued2011-12
dc.identifier.urihttps://hdl.handle.net/20.500.13015/3423
dc.descriptionDecember 2011
dc.descriptionSchool of Engineering
dc.descriptionCenter for Integrated Electronics
dc.language.isoENG
dc.publisherRensselaer Polytechnic Institute, Troy, NY
dc.relation.ispartofRensselaer Theses and Dissertations Online Collection
dc.subjectElectrical engineering
dc.titleElectrical evaluation and modeling of through-strata-vias (TSVs) in three-dimensional (3D) integration
dc.typeElectronic thesis
dc.typeThesis
dc.digitool.pid32506
dc.digitool.pid32507
dc.digitool.pid32509
dc.digitool.pid32508
dc.digitool.pid32510
dc.rights.holderThis electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
dc.description.degreePhD
dc.relation.departmentDept. of Electrical, Computer, and Systems Engineering


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