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    Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers

    Author
    Lay, Nicole E.
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    5108_lay_tpab.pdf (19.58Kb)
    5109_lay_diss.pdf (25.20Mb)
    Other Contributors
    Duquette, D. J.; Ramanath, G. (Ganpati); Shima, Mutsuhiro; Lu, T.-M. (Toh-Ming), 1943-;
    Date Issued
    2006-05
    Subject
    Materials science and engineering
    Degree
    PhD;
    Terms of Use
    This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.;
    Metadata
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    URI
    https://hdl.handle.net/20.500.13015/3719
    Abstract
    Description
    May 2006; School of Engineering
    Department
    Dept. of Materials Science and Engineering;
    Publisher
    Rensselaer Polytechnic Institute, Troy, NY
    Relationships
    Rensselaer Theses and Dissertations Online Collection;
    Access
    Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries.;
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    • RPI Theses Online (Complete)

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