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dc.rights.licenseRestricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries.
dc.contributorDuquette, D. J.
dc.contributorRamanath, G. (Ganpati)
dc.contributorShima, Mutsuhiro
dc.contributorLu, T.-M. (Toh-Ming), 1943-
dc.contributor.authorLay, Nicole E.
dc.date.accessioned2021-11-03T10:38:51Z
dc.date.available2021-11-03T10:38:51Z
dc.date.created2007-05-15T20:12:10Z
dc.date.issued2006-05
dc.identifier.urihttps://hdl.handle.net/20.500.13015/3719
dc.descriptionMay 2006
dc.descriptionSchool of Engineering
dc.language.isoENG
dc.publisherRensselaer Polytechnic Institute, Troy, NY
dc.relation.ispartofRensselaer Theses and Dissertations Online Collection
dc.subjectMaterials science and engineering
dc.titleSeedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers
dc.typeElectronic thesis
dc.typeThesis
dc.digitool.pid5107
dc.digitool.pid5108
dc.digitool.pid5110
dc.digitool.pid5109
dc.digitool.pid5111
dc.rights.holderThis electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
dc.description.degreePhD
dc.relation.departmentDept. of Materials Science and Engineering


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