| dc.rights.license | Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries. | |
| dc.contributor | Duquette, D. J. | |
| dc.contributor | Ramanath, G. (Ganpati) | |
| dc.contributor | Shima, Mutsuhiro | |
| dc.contributor | Lu, T.-M. (Toh-Ming), 1943- | |
| dc.contributor.author | Lay, Nicole E. | |
| dc.date.accessioned | 2021-11-03T10:38:51Z | |
| dc.date.available | 2021-11-03T10:38:51Z | |
| dc.date.created | 2007-05-15T20:12:10Z | |
| dc.date.issued | 2006-05 | |
| dc.identifier.uri | https://hdl.handle.net/20.500.13015/3719 | |
| dc.description | May 2006 | |
| dc.description | School of Engineering | |
| dc.language.iso | ENG | |
| dc.publisher | Rensselaer Polytechnic Institute, Troy, NY | |
| dc.relation.ispartof | Rensselaer Theses and Dissertations Online Collection | |
| dc.subject | Materials science and engineering | |
| dc.title | Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers | |
| dc.type | Electronic thesis | |
| dc.type | Thesis | |
| dc.digitool.pid | 5107 | |
| dc.digitool.pid | 5108 | |
| dc.digitool.pid | 5110 | |
| dc.digitool.pid | 5109 | |
| dc.digitool.pid | 5111 | |
| dc.rights.holder | This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author. | |
| dc.description.degree | PhD | |
| dc.relation.department | Dept. of Materials Science and Engineering | |
