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    High speed on-chip interconnect modeling and reliability assessment

    Author
    Diao, Jiedong
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    5710_diao_dis.pdf (1.949Mb)
    5711_diao_abs.pdf (15.30Kb)
    Other Contributors
    McDonald, John F. (John Francis), 1942-; Le Coz, Yannick L.; Zhang, Tong; Lu, T.-M. (Toh-Ming), 1943-;
    Date Issued
    2006-12
    Subject
    computer; Systems engineering; Electrical
    Degree
    PhD;
    Terms of Use
    This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.;
    Metadata
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    URI
    https://hdl.handle.net/20.500.13015/3759
    Abstract
    Description
    December 2006; School of Engineering
    Department
    Dept. of Electrical, Computer, and Systems Engineering;
    Publisher
    Rensselaer Polytechnic Institute, Troy, NY
    Relationships
    Rensselaer Theses and Dissertations Online Collection;
    Access
    Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries.;
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    • RPI Theses Online (Complete)

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