Show simple item record

dc.rights.licenseRestricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries.
dc.contributorGutmann, Ronald J.
dc.contributorLu, James Jian-Qiang
dc.contributorBhat, Ishwara B.
dc.contributorDutta, Partha S.
dc.contributorNalamasu, Omkaram
dc.contributor.authorMcMahon, J. Jay
dc.date.accessioned2021-11-03T07:45:34Z
dc.date.available2021-11-03T07:45:34Z
dc.date.created2008-03-19T12:07:29Z
dc.date.issued2008-05
dc.identifier.urihttps://hdl.handle.net/20.500.13015/524
dc.descriptionMay 2008
dc.descriptionSchool of Engineering
dc.descriptionCenter for Integrated Electronics
dc.language.isoENG
dc.publisherRensselaer Polytechnic Institute, Troy, NY
dc.relation.ispartofRensselaer Theses and Dissertations Online Collection
dc.subjectElectrical engineering
dc.titleDamascene patterned metal/adhesive wafer bonding for three-dimensional integration
dc.typeElectronic thesis
dc.typeThesis
dc.digitool.pid10430
dc.digitool.pid10431
dc.digitool.pid10433
dc.digitool.pid10432
dc.digitool.pid10434
dc.rights.holderThis electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
dc.description.degreePhD
dc.relation.departmentDept. of Electrical, Computer, and Systems Engineering


Files in this item

Thumbnail
Thumbnail

This item appears in the following Collection(s)

Show simple item record