Dielectric and electrical properties of polymer composites with high aspect ratio fillers
dc.rights.license | CC BY-NC-ND. Users may download and share copies with attribution in accordance with a Creative Commons Attribution-Noncommercial-No Derivative Works 3.0 License. No commercial use or derivatives are permitted without the explicit approval of the author. | |
dc.contributor | Schadler, L. S. (Linda S.) | |
dc.contributor | Nelson, J. Keith | |
dc.contributor | Siegel, R. W. (Richard W.) | |
dc.contributor | Ozisik, Rahmi | |
dc.contributor | Salon, S. J. (Sheppard Joel), 1948- | |
dc.contributor.author | Wang, Zepu | |
dc.date.accessioned | 2021-11-03T07:46:56Z | |
dc.date.available | 2021-11-03T07:46:56Z | |
dc.date.created | 2013-07-10T11:34:57Z | |
dc.date.issued | 2012-08 | |
dc.identifier.uri | https://hdl.handle.net/20.500.13015/556 | |
dc.description | August 2012 | |
dc.description | School of Engineering | |
dc.description | Rensselaer Nanotechnology Center | |
dc.language.iso | ENG | |
dc.publisher | Rensselaer Polytechnic Institute, Troy, NY | |
dc.relation.ispartof | Rensselaer Theses and Dissertations Online Collection | |
dc.rights | Attribution-NonCommercial-NoDerivs 3.0 United States | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/us/ | * |
dc.subject | Materials engineering | |
dc.title | Dielectric and electrical properties of polymer composites with high aspect ratio fillers | |
dc.type | Electronic thesis | |
dc.type | Thesis | |
dc.digitool.pid | 112788 | |
dc.digitool.pid | 112789 | |
dc.digitool.pid | 112791 | |
dc.digitool.pid | 112790 | |
dc.digitool.pid | 112792 | |
dc.rights.holder | This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author. | |
dc.description.degree | PhD | |
dc.relation.department | Dept. of Materials Science and Engineering |
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Except where otherwise noted, this item's license is described as CC BY-NC-ND. Users may download and share copies with attribution in accordance with a Creative Commons Attribution-Noncommercial-No Derivative Works 3.0 License. No commercial use or derivatives are permitted without the explicit approval of the author.