Development of barrierless dielectrics and their integration with copper for nanodevice wiring

dc.rights.license	Restricted to current Rensselaer faculty, staff and students. Access inquiries may be directed to the Rensselaer Research Libraries.
dc.contributor	Ramanath, G. (Ganpati)
dc.contributor	Interrante, Leonard V., 1939-
dc.contributor	Plawsky, Joel L., 1957-
dc.contributor	Siegel, R. W. (Richard W.)
dc.contributor	Lu, T.-M. (Toh-Ming), 1943-
dc.contributor.author	Singh, Binay Kumar
dc.date.accessioned	2021-11-03T07:54:36Z
dc.date.available	2021-11-03T07:54:36Z
dc.date.created	2009-03-18T17:33:42Z
dc.date.issued	2009-05
dc.identifier.uri	https://hdl.handle.net/20.500.13015/764
dc.description	May 2009
dc.description	School of Engineering
dc.language.iso	ENG
dc.publisher	Rensselaer Polytechnic Institute, Troy, NY
dc.relation.ispartof	Rensselaer Theses and Dissertations Online Collection
dc.subject	Chemical engineering
dc.title	Development of barrierless dielectrics and their integration with copper for nanodevice wiring
dc.type	Electronic thesis
dc.type	Thesis
dc.digitool.pid	15686
dc.digitool.pid	15687
dc.digitool.pid	15689
dc.digitool.pid	15688
dc.digitool.pid	15690
dc.rights.holder	This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
dc.description.degree	PhD
dc.relation.department	Dept. of Chemical and Biological Engineering

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