3D integration of inverted InGaAs MSM array to Si platform by low temperature chip-to-wafer bonding
Authors
Wu, Pengfei
ORCID
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Other Contributors
Huang, Zhaoran Rena
Lu, James Jian-Qiang
Schubert, E. Fred
Lu, James Jian-Qiang
Schubert, E. Fred
Issue Date
2013-08
Keywords
Electrical engineering
Degree
MS
Terms of Use
This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
Full Citation
Abstract
With the continuous scaling of the pitch width following Moore's Law, the global interconnects in microprocessors and high performance application-specific integrated circuit (ASIC) face more problems than ever to fulfill the signal synchronization and energy requirement. On-chip optical interconnect is a promising solution to this problem for reduced delay time and lowered power consumption. 3D integration of active compound optoelectronic devices to silicon chip is an important approach to realize on-chip optical interconnects and thus attracts more and more interests nowadays.
Description
August 2013
School of Engineering
School of Engineering
Department
Dept. of Electrical, Computer, and Systems Engineering
Publisher
Rensselaer Polytechnic Institute, Troy, NY
Relationships
Rensselaer Theses and Dissertations Online Collection
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