Quantitative analysis and modeling of 3-D TSV-based power delivery architectures
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Authors
He, Huanyu
Issue Date
2015-05
Type
Electronic thesis
Thesis
Thesis
Language
ENG
Keywords
Physics
Alternative Title
Abstract
Based on fundamental physics of 3-D integration components, the objective of this thesis work is to quantitatively analyze the power delivery for 3D-IC systems, develop appropriate physics-based models and simulation approaches, understand the key issues, and provide potential solutions for design of 3D-IC power delivery architectures.
Description
May 2015
School of Science
School of Science
Full Citation
Publisher
Rensselaer Polytechnic Institute, Troy, NY