FEA modeling of heat transfer between a Joule heated Wollaston probe and substrate

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Authors
Schomacker, Jason
Issue Date
2014-12
Type
Electronic thesis
Thesis
Language
ENG
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Mechanical engineering
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Abstract
This thesis describes a finite element model developed to simulate a microprobe experiment used to measure the thermal conductivities of thin films. First the experimental setup is described and an analytical model that was previously developed is presented. Next the development of the FEA model is described in detail. Results show that the assumption of a constant temperature probe tip and circular substrate temperature distribution are valid. The heat flux distribution on the substrate was found to be highly elliptical with a semi-major heat transfer radius of approximately 3 um and a semi-minor radius of approximately 1 um. The thermal contact resistance was calculated using these radii to be close to 90,000 K/W which is compared to the value from the analytical model and calibration of approximately 105,000 K/W. The probe thermal resistance was found to agree with experimental results within 2.5% error. This work suggests that the main heat transfer mode is air conduction and that the effects of other modes may not be significant for the cases studied here.
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December 2014
School of Engineering
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Rensselaer Polytechnic Institute, Troy, NY
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