Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers
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Authors
Lay, Nicole E.
Issue Date
2006-05
Type
Electronic thesis
Thesis
Thesis
Language
ENG
Keywords
Materials science and engineering
Alternative Title
Abstract
Description
May 2006
School of Engineering
School of Engineering
Full Citation
Publisher
Rensselaer Polytechnic Institute, Troy, NY