Damascene patterned metal/adhesive wafer bonding for three-dimensional integration

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Authors
McMahon, J. Jay
Issue Date
2008-05
Type
Electronic thesis
Thesis
Language
ENG
Keywords
Electrical engineering
Research Projects
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Alternative Title
Abstract
Description
May 2008
School of Engineering
Center for Integrated Electronics
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Publisher
Rensselaer Polytechnic Institute, Troy, NY
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Issue
URI
https://hdl.handle.net/20.500.13015/524
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DOI
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RPI Theses Online (Complete)