Electrical evaluation and modeling of through-strata-vias (TSVs) in three-dimensional (3D) integration

Thumbnail Image
Files
32507_phd thesis as RPI format.pdf (19 MB)
32508_abstitle-phd.pdf (70.75 KB)
Authors
Xu, Zheng
Issue Date
2011-12
Type
Electronic thesis
Thesis
Language
ENG
Keywords
Electrical engineering
Research Projects
Organizational Units
Journal Issue
Alternative Title
Abstract
Description
December 2011
School of Engineering
Center for Integrated Electronics
Full Citation
Publisher
Rensselaer Polytechnic Institute, Troy, NY
Terms of Use
Journal
Volume
Issue
URI
https://hdl.handle.net/20.500.13015/3423
PubMed ID
DOI
ISSN
EISSN
Collections
RPI Theses Online (Complete)