Mechanical and thermal stability of molecularly engineered Cu-silica interfaces using organosilane nanolayers

Authors
Gandhi, Darshan D.
ORCID
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Other Contributors
Ramanath, G. (Ganpati)
Schadler, L. S. (Linda S.)
Ozisik, Rahmi
Plawsky, Joel L., 1957-
Lane, Michael W.
Issue Date
2007-08
Keywords
Materials science and engineering
Degree
PhD
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This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
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Abstract
Description
August 2007
School of Engineering
Department
Dept. of Materials Science and Engineering
Publisher
Rensselaer Polytechnic Institute, Troy, NY
Relationships
Rensselaer Theses and Dissertations Online Collection
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