Mechanical and thermal stability of molecularly engineered Cu-silica interfaces using organosilane nanolayers
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Authors
Gandhi, Darshan D.
Issue Date
2007-08
Type
Electronic thesis
Thesis
Thesis
Language
ENG
Keywords
Materials science and engineering
Alternative Title
Abstract
Description
August 2007
School of Engineering
School of Engineering
Full Citation
Publisher
Rensselaer Polytechnic Institute, Troy, NY