Integrated flip-chip flex-circuit packaging for power electronics applications

Authors
Xiao, Ying
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Other Contributors
Gutmann, Ronald J.
Chow, T. Paul
Nalamasu, Omkaram
Rymaszewski, Eugene J.
Schoch, Paul M.
Torrey, David A.
Issue Date
2003-08
Keywords
Electrical engineering
Degree
PhD
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This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
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Abstract
Description
August 2003
School of Engineering
Department
Dept. of Electrical, Computer, and Systems Engineering
Publisher
Rensselaer Polytechnic Institute, Troy, NY
Relationships
Rensselaer Theses and Dissertations Online Collection
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