Performance of through strata vias (TSVs) in three-dimensional integration
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Authors
Xu, Zheng
Issue Date
2009-08
Type
Electronic thesis
Thesis
Thesis
Language
ENG
Keywords
Electrical engineering
Alternative Title
Abstract
Description
August 2009
School of Engineering
Center for Integrated Electronics
School of Engineering
Center for Integrated Electronics
Full Citation
Publisher
Rensselaer Polytechnic Institute, Troy, NY