3D logic-memory integration for high performance embedded system and reconfigurable computing

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Authors
Pan, Yangyang
Issue Date
2010-12
Type
Electronic thesis
Thesis
Language
ENG
Keywords
Electrical engineering
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December 2010
School of Engineering
Center for Integrated Electronics
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Rensselaer Polytechnic Institute, Troy, NY
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Attribution-NonCommercial-NoDerivs 3.0 United States
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https://hdl.handle.net/20.500.13015/3181
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RPI Theses Open Access
RPI Theses Online (Complete)