3D logic-memory integration for high performance embedded system and reconfigurable computing

Authors
Pan, Yangyang
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Other Contributors
Zhang, Tong
Issue Date
2010-12
Keywords
Electrical engineering
Degree
MS
Terms of Use
Attribution-NonCommercial-NoDerivs 3.0 United States
This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
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Abstract
Description
December 2010
School of Engineering
Center for Integrated Electronics
Department
Dept. of Electrical, Computer, and Systems Engineering
Publisher
Rensselaer Polytechnic Institute, Troy, NY
Relationships
Rensselaer Theses and Dissertations Online Collection
Access
CC BY-NC-ND. Users may download and share copies with attribution in accordance with a Creative Commons Attribution-Noncommercial-No Derivative Works 3.0 License. No commercial use or derivatives are permitted without the explicit approval of the author.