Study of thermal properties of packaged light-emitting diodes by transient junction temperature measurement
Authors
Shan, Qifeng
Issue Date
2009-05
Type
Electronic thesis
Thesis
Thesis
Language
ENG
Keywords
Physics
Alternative Title
Abstract
Description
May 2009
School of Science
School of Science
Full Citation
Publisher
Rensselaer Polytechnic Institute, Troy, NY