A novel rate-objective model for the large-scale simulation of temperature dependent inelasticity phenomena

Authors
Li, Zhen
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Other Contributors
Oberai, Assad
Shephard, Mark S.
Maniatty, Antoinette M.
Li, Fengyan
Bloomfield, Max O.
Issue Date
2017-08
Keywords
Mechanical engineering
Degree
PhD
Terms of Use
This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
Full Citation
Abstract
We apply this workflow in modeling and analyzing the evolution of stresses of solder joints arrays in the flip chip manufacturing process in microelectronics fabrication. We also conduct a variety of simulations of solder joints arrays, including large-scale (up to 1 billion of degree of freedoms) simulations on IBM Blue Gene/Q supercomputer, and perform scaling studies. We analyze the stress by tracking the evolution of stresses at critical regions with respect to time. We also present the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are observed in a solder joint near the center of the array and in the corner of the array.
Description
August 2017
School of Engineering
Department
Dept. of Mechanical, Aerospace, and Nuclear Engineering
Publisher
Rensselaer Polytechnic Institute, Troy, NY
Relationships
Rensselaer Theses and Dissertations Online Collection
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