3D integration of inverted InGaAs MSM array to Si platform by low temperature chip-to-wafer bonding
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Authors
Wu, Pengfei
Issue Date
2013-08
Type
Electronic thesis
Thesis
Thesis
Language
ENG
Keywords
Electrical engineering
Alternative Title
Abstract
With the continuous scaling of the pitch width following Moore's Law, the global interconnects in microprocessors and high performance application-specific integrated circuit (ASIC) face more problems than ever to fulfill the signal synchronization and energy requirement. On-chip optical interconnect is a promising solution to this problem for reduced delay time and lowered power consumption. 3D integration of active compound optoelectronic devices to silicon chip is an important approach to realize on-chip optical interconnects and thus attracts more and more interests nowadays.
Description
August 2013
School of Engineering
School of Engineering
Full Citation
Publisher
Rensselaer Polytechnic Institute, Troy, NY