Development of barrierless dielectrics and their integration with copper for nanodevice wiring

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Authors
Singh, Binay Kumar
Issue Date
2009-05
Type
Electronic thesis
Thesis
Language
ENG
Keywords
Chemical engineering
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May 2009
School of Engineering
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Rensselaer Polytechnic Institute, Troy, NY
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https://hdl.handle.net/20.500.13015/764
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RPI Theses Online (Complete)